| 1. | Electronic assembly manufacturers qualification profile
电子配件生产商资格证明纲要 |
| 2. | Mqp electronic assembly manufacturers qualification profile
电子组件制造商的资格纲要 |
| 3. | General specification for semiconductor opto - electronic assembly
半导体光电组件总规范 |
| 4. | Developing and producing base of electronic assembly equipment
电子装联设备开发生产项目 |
| 5. | Requirements for soldered electrical and electronic assemblies
软钎焊电气和电子组件的要求 |
| 6. | Requirements for soldered electrical and electronic assemblies
焊接的电气和电子组件的要求 |
| 7. | Shanxi huayi electronic assembly equipment group co . ltd
山西华艺电子装联设备集团股份有限公司 |
| 8. | Workmanship requirements for soldered electronic assemblies - general
钎焊电子组件的工艺要求.总则 |
| 9. | Workmanship requirements for soldered electronic assemblies - terminal assemblies
钎焊电子组件的工艺要求.终端组件 |
| 10. | Workmanship requirements for soldered electronic assemblies - part 1 : general
钎焊电子组件的工艺要求.第1部分:总则 |
